Foxconn Shows Off Token Factory Tech and NVIDIA DSX POD at Hon Hai Tech Day 2026
Foxconn used the 7th Hon Hai Tech Day to present its token factory solutions, showing the components and system technologies behind next-generation AI infrastructure on the NVIDIA Vera Rubin platform. The event features a record 321 exhibits and, for the first time, the NVIDIA DSX POD reference design.
- Foxconn's 7th Hon Hai Tech Day features a record 321 exhibits, a quarter of them in the Token Factory zone.
- Foxconn showed the NVIDIA DSX POD, a factory-built reference design for preintegrating NVIDIA Vera Rubin rack-scale AI infrastructure in modular containers.
- Visionbay.ai is planning its facility design around NVIDIA DSX MaxLPS principles to maximize performance per watt.
- The event runs October 30-31 at the Taipei Nangang Exhibition Center and adds a Precision Manufacturing zone and a children's pavilion.
Vera Rubin work from components to racks
Hon Hai Technology Group (Foxconn), which describes itself as the world's largest electronics manufacturer and AI server provider, held the 7th annual Hon Hai Tech Day 2026 (HHTD26) in Taipei. According to the company, the show gave an unprecedented look at the vertical integration and precision manufacturing behind its work on the NVIDIA Vera Rubin platform, ranging from rack-level AI supercomputing system integration to sub-micron-level component manufacturing.
Foxconn also said it gave a spotlight to its partnerships for the first time. A customer zone with key moment photos and milestone technology timelines was set up to recognize those behind-the-scenes relationships.
Foxconn Chairman Young Liu said: "Foxconn is transforming into a technology manufacturing platform service provider." He added that the company is building this strength across ecosystems from smart consumer electronics to AI and EV, as well as in space and robotics.
Token Factory zone and NVIDIA DSX POD
A quarter of the record 321 exhibits made up the Token Factory zone. Foxconn presented the NVIDIA DSX POD, a standardized, factory-built reference design. According to the company, it lets partners preintegrate NVIDIA Vera Rubin rack-scale AI infrastructure in modular containers, complete critical validation before shipment and connect the units to prepared site infrastructure after delivery. The pod dominated the venue and welcomed visitors.
The zone also included a 20-meter long wall showing PCBs mounted with tens of thousands of micron-level precision-engineered components. Other highlights were:
- An AI server compute tray design that is cable-free, hose-free and fanless, in a single generation.
- Co-packaged optics (CPO), which Foxconn called the next AI megatrend.
- Power, cooling and high-speed data solutions re-imagined for more efficient AI infrastructure.
An immersive simulated AI data hall showed how AI compute, networking, power and cooling are co-designed for an AI factory, including NVIDIA 800 VDC power distribution.
Visionbay.ai, Foxconn's dedicated business unit for AI supercomputing and cloud operations and an NVIDIA Cloud Partner, is planning its facility design to follow NVIDIA DSX MaxLPS principles. The aim is to maximize AI factory performance per watt within a fixed power envelope and to optimize computing, power and cooling configurations before construction.
Robotics, precision manufacturing and AI safety
The Robotics and Humanoid zone brought together what Foxconn called the most embodied intelligence at any HHTD so far, with real-world examples of industrial products used in robotics. A new Precision Manufacturing zone highlighted Foxconn's ultra-precision heritage, backed by proprietary machining, materials processing and mold making equipment. Technologies shown there have resulted in Poketomo AI companion robots and one-punch enclosures for laptops.
AI safety ran through several exhibits. Foxconn teams demonstrated how the NVIDIA Open Agent Safety Platform could support agent safety across smart healthcare, smart manufacturing and robotics, and smart city.
On stage, NVIDIA, Google LLC and Schneider Electric discussed AI infrastructure, while Honda R&D Co Ltd and Mitsubishi Electric Mobility discussed next generation electromobility.
What it means
The showing positions Foxconn as more than an assembler of AI servers, stressing integration from tiny components to complete rack systems and pre-validated modular units. For AI infrastructure customers, the DSX POD approach as described by Foxconn points to systems that are tested before shipment and connected to prepared sites on arrival.
HHTD26 runs from October 30 to 31 at the Taipei Nangang Exhibition Center, Hall 1, 1F and 4F. The two-day conference also launched a family-friendly pavilion for children, with hands-on themes including sustainability, mobility, smart factory and smart city.
