LITEON Showcases Optical Interconnects for AI Data Centers
LITEON Technology is showcasing high-speed optical interconnects and optoelectronic technologies for AI data centers at electronica 2026 in Munich. The company’s “Intelligent Photonics” exhibit also covers power management, sensing, augmented reality and virtual reality applications.
- LITEON is exhibiting at electronica 2026 in Munich from 10 to 13 November.
- Its VHP ELS and ELSFP solutions support CPO and NPO switch architectures.
- The company is showing isolation and power-control technologies for 800 VDC systems.
- Its sensing portfolio includes multizone ToF, Direct ToF, metalens and SWIR technologies.
- The exhibit includes MicroLED, color optical engine and waveguide technologies for AR.
Optical connectivity for AI infrastructure
LITEON is presenting its VHP External Laser Source (ELS) technology and ELSFP solutions at the trade show, which runs in Munich from 10 to 13 November. According to the company, the solutions support co-packaged optics (CPO) and near-packaged optics (NPO) switch architectures.
LITEON says these technologies are designed to provide scalable optical connectivity for AI clusters and future data centers. The solutions can be adapted to different system configurations, liquid-cooling architectures and integration requirements, which the company says can help customers build more efficient AI networking infrastructure.
The company links the development to the expanding use of AI computing. It says data centers need higher bandwidth, lower latency and improved energy efficiency as AI-based computing grows. Sander Su, LITEON’s general manager of optoelectronic product solutions, said the company is combining technologies across key components, modules and system-level applications to address demand for high-speed transmission, greater efficiency and intelligent sensing.
Power isolation and control beyond data centers
LITEON’s exhibit also extends its optoelectronics portfolio into power conversion and control. The company is showing isolation and power-control technologies for 800 VDC power systems and power architectures used in AI data centers.
The displayed portfolio includes isolation amplifiers, gate drivers, high-speed optocouplers, photovoltaic relays and reinforced isolation platforms. LITEON says these products are intended to support safe and reliable power conversion, along with precise signal sensing and control in high-voltage and high-power environments.
According to LITEON, the same technologies support solar inverters, battery management systems, electric vehicle charging and industrial automation. The company presents these applications as areas where its optoelectronic expertise can contribute to safety, reliability and energy efficiency.
Sensing and augmented reality technologies
Beyond data center infrastructure, LITEON is demonstrating multizone time-of-flight (ToF) sensing, Direct ToF, metalens dot projectors and short-wave infrared (SWIR) sensing technologies. The company says they are intended for robotics, machine vision, industrial automation, autonomous navigation and augmented and virtual reality applications.
The exhibition also includes augmented reality optical technologies such as MicroLED display modules, color optical engines, waveguide integration and AR optical system design. LITEON says the showcase demonstrates how it is extending its optoelectronic semiconductor capabilities from sensing components to optical modules and integrated systems.
For users and customers, the exhibit signals LITEON’s focus on several connected parts of emerging infrastructure, from optical links and high-voltage power systems to sensing and immersive computing. The company’s presentation at electronica 2026 positions these technologies for AI data centers, smart devices and industrial applications, without announcing specific product release dates or commercial availability.
