LITEON Showcases Optical Links and Photonics for AI Data Centers
LITEON Technology is presenting high-speed optical interconnects and optoelectronic technologies for AI data centers at electronica 2026 in Munich. Its portfolio also covers power isolation and control, intelligent sensing and augmented reality optics.
- LITEON is exhibiting at electronica 2026 in Munich from 10 to 13 November.
- Its VHP ELS and ELSFP solutions support CPO and NPO switching architectures.
- The company is presenting technologies for 800 VDC power systems and AI data centers.
- Its sensing portfolio includes ToF, Metallens and SWIR technologies.
- The exhibition includes MicroLED and augmented reality optical technologies.
Optical connectivity for AI infrastructure
LITEON is taking part in electronica 2026, held in Munich, Germany, from 10 to 13 November. Under the theme "Intelligent Photonics," the company is presenting optoelectronic semiconductor technologies aimed at data centers, energy management and intelligent applications.
The company is highlighting its VHP External Laser Source, or ELS, technology and ELSFP solutions. According to LITEON, these products are compatible with CPO and NPO switching architectures and are designed to provide scalable, high-performance optical connectivity for AI clusters and future data centers.
LITEON says the solutions can adapt to different system configurations, liquid-cooling architectures and integration requirements. The company positions them as tools to help customers build more efficient AI networking infrastructure as AI computing increases demand for bandwidth, lower latency and energy efficiency.
Power isolation and control for high-voltage systems
LITEON is also showing isolation and power-control technologies for 800 VDC power systems and power architectures used in AI data centers. The portfolio includes isolation amplifiers, gate drivers, high-speed optocouplers, photorelays and reinforced-isolation platforms.
According to the company, these technologies support safe and reliable power conversion, as well as precise signal sensing and control in high-voltage and high-power environments. LITEON says the same technologies can be used in solar inverters, battery management systems, electric vehicle charging and industrial automation.
Sander Su, general manager of LITEON's Optoelectronic Product Solutions, said the company is integrating technologies across key components, modules and system-level applications. LITEON describes this approach as a way to address demand for high-speed transmission, greater efficiency and intelligent sensing as AI infrastructure expands.
Sensing and augmented reality optics
The exhibition extends beyond data-center infrastructure. LITEON is presenting multi-zone ToF, direct ToF, Metallens dot projectors and SWIR sensing technologies for robotics, machine vision, industrial automation, autonomous navigation and augmented reality and virtual reality applications.
The company is also displaying augmented reality optical technologies, including MicroLED display modules, full-color optical engines, waveguide integration and augmented reality optical system design. LITEON says the offering demonstrates its reach from sensing components to optical modules and integrated systems.
For users and the wider market, the announcement shows how LITEON is targeting several parts of the AI infrastructure stack, from optical data transmission and high-voltage power control to sensing and immersive computing. The company is presenting these technologies at electronica 2026 through 13 November, with its stated focus on intelligent photonics and applications for data centers, energy systems and emerging devices.
