Longsys to show industrial-grade mSSD and edge AI storage at electronica 2026
Longsys will unveil its first industrial-grade, wide-temperature mSSD at electronica 2026 in Munich, alongside a range of automotive and industrial storage products aimed at AI running on edge devices. The trade show takes place from 10 to 13 November.
- Longsys will unveil its first industrial-grade, wide-temperature mSSD at electronica 2026 in Munich, 10 to 13 November.
- The mSSD uses system-in-package technology, integrating controller, flash memory and passive components in one package.
- Longsys will also show UFS, eMMC, LPDDR and SPI NAND Flash, plus Lexar USB drives and memory cards.
- Live demos of AISSD, AIDIMM and HLCache UFS target model loading, data access and cache acceleration for edge AI.
- The company is at booth C2.459, Hall C2, Messe München.
A storage theme built around edge AI
Longsys (301308.SZ/09976.HK) says AI is moving from the cloud to devices at the edge, and that this shift creates new demands for storage. The company will present new products and edge AI storage solutions under the theme "Le stockage intégré au service de l'IA en périphérie", or embedded storage serving edge AI.
According to Longsys, automotive and industrial applications need storage with high bandwidth, high endurance and reliable operation across wide temperature ranges and in harsh environments, while also supporting real-time perception and AI inference. The company argues that storage is no longer just a place to keep data, but an essential foundation for reliable AI built into devices.
The industrial-grade mSSD
The headline product is what Longsys describes as its first industrial-grade mSSD able to operate across a wide temperature range. It is based on system-in-package (SiP) technology, which places the controller, the flash memory and passive components in a single package.
According to the company, this removes the need for surface-mount technology (SMT) assembly and reduces both material use and manufacturing process requirements. By eliminating the solder joints associated with conventional circuit board assembly, the design also removes the risk of solder joint failure, Longsys says.
The product is resistant to water, dust and shock, which the company says gives it inherent industrial-grade reliability and a wide operating temperature range. Longsys adds that environmental considerations were built into its design and manufacture, supporting more sustainable industrial applications.
Broader product range and live demos
Longsys will also show a full range of automotive-grade and industrial-grade storage solutions, including UFS, eMMC, LPDDR and SPI NAND Flash. Lexar, the company's premium consumer storage brand, will present USB drives and memory cards for dashcams, as well as industrial-grade SD and microSD solutions.
Longsys says these products support applications in smart cockpits, advanced driver assistance systems (ADAS), industrial control and rail transport.
Live demonstrations of AISSD, AIDIMM and HLCache UFS will show form factors and storage solutions designed to optimize data access, model loading and cache acceleration for AI embedded in devices. According to Longsys, they help simplify system design, improve inference responsiveness and strengthen system stability.
Where to find Longsys
Longsys will be at booth C2.459 in Hall C2 of the Messe München. The company, founded in 1999, describes itself as a global leader in branded semiconductor memory, covering research and development, design, packaging and testing, manufacturing and sales services.
The announcement points to a market where memory and storage makers are positioning products around on-device AI, especially for vehicles and industrial equipment. The source gives no pricing or availability details for the new mSSD or the other products.
