Raytron leads global thermal imaging shipments with 30% share
Raytron ranked first in global thermal imaging device shipments in 2025, capturing a 30% share of the market, according to a Yole Group report cited in a company announcement. The five largest infrared technology manufacturers together accounted for around 90% of worldwide shipments.
- Raytron held a 30% share of global thermal imaging device shipments in 2025.
- The five largest infrared manufacturers represented around 90% of worldwide shipments.
- Raytron's 8 μm infrared detector reached mass production in 2025.
- BCoS packaging reduces detector thickness by approximately 21% and area by nearly 40%, according to Raytron.
- The company's infrared vision-language model was trained on more than 5 million samples.
Raytron holds the top position
The figures come from Thermal Imaging and Sensing 2026, a report by global market research and strategic consulting firm Yole Group. Raytron said the report places it first among the five leading infrared technology manufacturers, marking its second consecutive year in the top position.
The company is based in Yantai, China. Its announcement says infrared technology, particularly uncooled thermal imaging, is expanding beyond established security and industrial inspection markets. Automotive products, outdoor equipment and smart devices are among the areas now being reached by the technology.
Raytron attributed its position to continued investment across infrared detector development, advanced packaging techniques and artificial intelligence algorithms. The company presented these areas as part of its effort to improve thermal imaging performance and widen its applications.
Smaller pixels support more compact detectors
Raytron has progressively reduced the pixel size of its infrared detectors from 35 μm to 17 μm, 12 μm and 8 μm. The company developed its 8 μm infrared detector in 2021 and reached mass production in 2025.
A smaller pixel size allows more pixels to fit on the same detector surface, improving spatial resolution. According to Raytron, it can also enable more compact detectors and lower system costs while maintaining the same resolution. The company links those changes to broader adoption of thermal imaging technology.
Raytron also described packaging work based on wafer-level packaging, or WLP. Its SWLP, or Super Wafer Level Packaging, uses a double-layer structure intended to improve detector protection and reduce reliance on specialized cleanroom environments during later integration stages.
Packaging and AI target wider adoption
At CIOE 2026, Raytron introduced BCoS, or Bump Chip on Substrate packaging. Compared with traditional WLP solutions, the company says BCoS removes wire connections and simplifies the packaging structure. For products with equivalent specifications, Raytron reported that the approach reduces detector thickness by approximately 21% and occupied area by nearly 40%.
Raytron also unveiled its Infrared Vision-Language Model at CIOE 2026. The model was trained on the company's own multimodal infrared dataset, which contains more than 5 million samples. Raytron says it can be deployed directly on the device and is already being used for intelligent analysis in industrial temperature measurement, gas detection and night-vision security.
The announcement positions these developments as a way to add value for customers while broadening thermal imaging's use across multiple industries. For users and equipment makers, the company's stated direction points to smaller detectors, more efficient integration and on-device AI capabilities, although the announcement does not provide comparative performance figures or product availability details.
PR Newswire: Raytron a la cabeza en los envíos globales de dispositivos de imagen térmica