Raytron Leads Thermal Imaging Shipments With 30% Global Share
Raytron ranked first in global infrared shipments in 2025 with a 30% share, according to Yole Group’s Thermal Imaging and Sensing 2026 report. The report found that the top five infrared manufacturers together accounted for around 90% of total shipments.
- Raytron held a 30% share of global infrared shipments in 2025.
- The top five manufacturers accounted for around 90% of total shipments.
- Raytron’s 8 μm detector reached mass production in 2025.
- BCoS reduces detector thickness by approximately 21% and footprint by nearly 40%.
- Raytron’s infrared model was trained on over 5 million data samples.
Raytron leads a concentrated market
The findings were published by PR Newswire on Nov. 11, 2026, in an announcement from Raytron. The company said it maintained its global leadership for the second consecutive year.
The report covers a market where infrared technology, particularly uncooled thermal imaging, is expanding beyond traditional security and industrial inspection. The announcement also identifies automotive, outdoor consumer products and smart devices as growing application areas.
Yole Group, described in the announcement as a global market research and strategy consulting firm, compiled the figures in Thermal Imaging and Sensing 2026. The shipment figures refer to 2025, while Raytron linked its position to investment in infrared detectors, advanced packaging and AI algorithms.
Smaller detectors and more compact packaging
Raytron said it has reduced infrared detector pixel pitch through successive generations, moving from 35 μm to 17 μm, 12 μm and 8 μm. It developed its 8 μm infrared detector in 2021 and achieved mass production in 2025.
According to the company, smaller pixel pitches allow more pixels to fit into the same detector area, improving spatial resolution. They can also support smaller detectors and lower system costs at the same resolution, which Raytron says may help broaden thermal imaging adoption.
The company also described its packaging work. After building on WLP, Raytron introduced SWLP, or Super Wafer Level Packaging, with a dual-layer structure intended to improve detector protection and reduce dependence on specialized cleanroom environments during downstream integration.
At CIOE 2026, Raytron introduced BCoS, or Bump Chip on Substrate. The company said the technology eliminates wire bonding and simplifies the packaging structure compared with traditional WLP solutions. For products with equivalent specifications, Raytron said BCoS reduces detector thickness by approximately 21% and footprint by nearly 40%.
AI expands thermal imaging applications
Raytron also presented an Infrared Vision-Language Model at CIOE 2026. The model was trained on a proprietary multimodal infrared dataset comprising over 5 million data samples, according to the company.
Raytron said the model has achieved on-device deployment and is already used for intelligent analytics in industrial temperature measurement, gas detection and night vision security. The company described artificial intelligence as an emerging driver of wider thermal imaging adoption.
For users and industries, the announcement points to thermal imaging becoming smaller, more integrated and more capable of automated analysis. Raytron’s stated objective is to expand applications across industries while creating what it calls “Incremental Value for Customers Through Technological Advancement.”