Raytron Leads Global Thermal Imaging Shipments With 30% Share
Raytron ranked first in global infrared sensor shipments in 2025, with a 30% market share, according to Yole Group. The five largest manufacturers together accounted for about 90% of worldwide shipments, as thermal imaging expands beyond security and industrial inspection.
- Raytron held a 30% share of global infrared sensor shipments in 2025.
- The five leading manufacturers represented about 90% of worldwide shipments.
- Raytron reached mass production of its 8 μm infrared detector in 2025.
- BCoS reduces detector thickness by about 21% and footprint by nearly 40%, according to Raytron.
- Its infrared vision and language model was trained on more than 5 million samples.
Raytron holds the top position
The findings come from Yole Group’s report, Thermal Imaging and Sensing 2026, cited in a Raytron announcement published by PR Newswire on November 11, 2026. The report says the five leading infrared sensor manufacturers represented approximately 90% of total global shipments in 2025.
Raytron had a 30% share and retained its global leadership for the second consecutive year. According to the company, that position is supported by continued investment in infrared detector development, advanced packaging and artificial intelligence algorithms.
Thermal imaging is being applied beyond traditional security and industrial inspection markets. The source identifies automotive applications, outdoor consumer products and connected devices as areas where the technology is expanding.
Smaller pixels and more compact detectors
Raytron has reduced infrared detector pixel pitch through successive steps from 35 μm to 17 μm, 12 μm and 8 μm. The company developed its 8 μm infrared detector in 2021 and reached mass production in 2025.
Smaller pixel spacing allows more pixels to be placed in the same detector area, which improves spatial resolution. It can also reduce detector size and lower system costs at the same resolution, according to the source. Raytron says these changes can support broader adoption of thermal imaging technology.
The company is also developing packaging technologies. Based on wafer-level packaging, Raytron introduced SWLP, or Super Wafer Level Packaging, which uses a double-layer structure intended to improve detector protection and reduce reliance on specialized clean rooms during downstream integration.
Packaging and AI broaden thermal imaging use
At CIOE 2026, Raytron presented BCoS, or Bump Chip on Substrate packaging. Compared with traditional WLP solutions, BCoS removes wire bonding and simplifies the package structure. For products with equivalent technical specifications, Raytron says the technology reduces detector thickness by about 21% and footprint by nearly 40%.
Raytron also unveiled an infrared vision and language model at CIOE 2026. The model was trained on the company’s proprietary multimodal infrared dataset, which contains more than 5 million samples. The source says it has been deployed directly on devices and is already being used for intelligent analysis in industrial temperature measurement, gas detection and night-vision security.
The company’s stated direction is to use technological progress to create added value for customers while improving imaging performance and expanding thermal imaging into more industries. The reported shipment concentration and Raytron’s investment in smaller detectors, packaging and on-device AI show how competition is extending beyond sensor production to the systems and applications built around infrared data.